Report
Revision as of 15:02, 31 March 2025 by Ahurhina@nikhef.nl (talk | contribs) (→Cleaning and stress tests done to solder flux samples)
Cleaning and stress tests done to solder flux samples
Cleaning
Each sample was wiped for 30 seconds with the corresponding cleaning agent. In the case Tickopur an ultrasonic bath was used at 30°C temperature for 10 min each step and a rinse in DI water.
Results of Cleaning
Value corresponds to the ratio of amount of light left after the cleaning with respect to the amount of light present before the cleaning.