Martin Fransen (26-3-2012): I investigated a few chips from the second batch from IZM that broke down due to sparks. The photo 'damaged-grid' shows the damage in a grid due to sparks, the photo 'spots-on-SiRN' shows the protection layer beneath it. The photo 'craters' speaks for itself, it is a close up of the spots.

I broke a chip into pieces to examine the cross section. The picture '3views' shows how the chip broke, the fact that the SiRN follows the structure is a sign that those 'lines' are the weak spots. One can see in the cross sections that there are pinholes, which can best be distinguished in 'slice2'.

According to my opinion most of these chips will unavoidably fail when used with an Ingrid. The growth of this layer should be controlled better. Later this week I will perform the same examination on a chip that has proven to withstand many discharges to see if there is a major difference. I will let you know the results.

   
   
   
   
   

-- NielsVanBakel - 2012-04-05

Topic attachments
I Attachment Action Size Date Who Comment
Unknown file formatJPG 3views.JPG manage 387.4 K 2012-04-05 - 08:44 NielsVanBakel  
Unknown file formatJPG craters.JPG manage 841.1 K 2012-04-05 - 08:59 NielsVanBakel  
Unknown file formatJPG damaged-grid.JPG manage 789.1 K 2012-04-05 - 09:00 NielsVanBakel  
Unknown file formatJPG spots-on-SiRN.JPG manage 831.7 K 2012-04-05 - 09:00 NielsVanBakel  
Topic revision: r1 - 2012-04-05 - NielsVanBakel
 
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