Daily update

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Revision as of 16:42, 20 February 2017 by Gorans@nikhef.nl (talk | contribs)
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20 February 2017


  • straight knife measured to be bent with deviations up to 20 microns

  • cutting wheel quite possibly damaged

  • attempted cutting of module with silicon removed showed that the module is not immobile during cutting

  • movement in 10s of microns while cutting observed (could be solved with new/better knife and wheel)


  • status after last weeks cutting

  • immediate steps needed for next cutting

  • update on sensors for the transport box


  1. repair knife and wheel (Gerrit)
  2. measure friction due to vacuum (Marco, GS)
  3. try to remove 2 silicon chips for future cutting simulations<\li>
  4. measure module movement with deeper wheel bite and/or smaller cut angle(Paul, GS)
  5. decide on the position of the sensors in the transport box
  6. measure environmental effects and shock on the transport box