Difference between revisions of "Daily update"

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<li> repair knife and wheel (Gerrit)</li>
 
<li> repair knife and wheel (Gerrit)</li>
 
<li> measure friction due to vacuum (Marco, GS)</li>
 
<li> measure friction due to vacuum (Marco, GS)</li>
<li> try to remove 2 silicon chips for future cutting simulations<\li>
+
<li> try to remove 2 silicon chips for future cutting simulations</li>
 
<li> measure module movement with deeper wheel bite and/or smaller cut angle(Paul, GS)</li>
 
<li> measure module movement with deeper wheel bite and/or smaller cut angle(Paul, GS)</li>
 
<li> decide on the position of the sensors in the transport box</li>
 
<li> decide on the position of the sensors in the transport box</li>
 
<li> measure environmental effects and shock on the transport box</li>
 
<li> measure environmental effects and shock on the transport box</li>
 
</ol>
 
</ol>

Revision as of 15:44, 20 February 2017

20 February 2017

Status

  • straight knife measured to be bent with deviations up to 20 microns

  • cutting wheel quite possibly damaged

  • attempted cutting of module with silicon removed showed that the module is not immobile during cutting

  • movement in 10s of microns while cutting observed (could be solved with new/better knife and wheel)

Discussed

  • status after last weeks cutting

  • immediate steps needed for next cutting

  • update on sensors for the transport box

ToDo:

  1. repair knife and wheel (Gerrit)
  2. measure friction due to vacuum (Marco, GS)
  3. try to remove 2 silicon chips for future cutting simulations
  4. measure module movement with deeper wheel bite and/or smaller cut angle(Paul, GS)
  5. decide on the position of the sensors in the transport box
  6. measure environmental effects and shock on the transport box