Daily update

Status

• straight knife measured to be bent with deviations up to 20 microns

• cutting wheel quite possibly damaged

• attempted cutting of module with silicon removed showed that the module is not immobile during cutting

• movement in 10s of microns while cutting observed (could be solved with new/better knife and wheel)

Discussed

• status after last weeks cutting

• immediate steps needed for next cutting

• update on sensors for the transport box

ToDo:

1. repair knife and wheel (Gerrit)
2. measure friction due to vacuum (Marco, GS)
3. try to remove 2 silicon chips for future cutting simulations<\li>
4. measure module movement with deeper wheel bite and/or smaller cut angle(Paul, GS)
5. decide on the position of the sensors in the transport box
6. measure environmental effects and shock on the transport box