Daily update

Turijn shipping list

1. flipper + pins
2. gripper (2x)
3. cutter
1. microscopes packed separately
2. clamp
3. tools for assembly
4. pins
5. extra cutting knife
4. vacuum system (+ tubes)
5. scalpels
6. third microscope
7. Samsung camera
1. gorilla stand
2. charger
3. memory card + reader
4. cables

Progress

• circle investigated on dummy with various optics

• new gloves in blue cabinet

Links

• [1] Dropbox link to pics

ToDo:

1. order isopropanol (Rob Buis) and air cans/cannon (Paul, GS)
2. choose and order stereomicroscope (Paul, GS)
3. make Windows installer (Paul)
4. prepare for wing cutting (Marco, Gerrit)
5. start listing possible issues for "Service Manual" (GS)

Status

• flipper not operational

• attack angle confirmed

• second dummy module successfully cut!

• shock test redone at 50Hz, w/o 1kHz peak search

Links

• [2] Dropbox link to pics and videos

ToDo:

1. make new flipper!
2. investigate vacuum hole induced damage to silicon
3. test environmental effects on the transport box (Marco, GS)
4. start listing possible issues for "Service Manual" (GS)

Status

• new straight knife and cutting wheel

• vacuum tightness much better

• wheel at 2mm depth

• attack angle existent (?)

• first dummy module successfully cut!

Links

• [3] Side view cut video.
• [4] Front view cut video.

ToDo:

1. test new flipper
2. cut second dummy module (all)
3. test environmental effects on the transport box (Marco, GS)
4. start listing possible issues for "Service Manual" (GS)

Status

• straight knife measured to be bent with deviations up to 20 microns

• cutting wheel quite possibly damaged

• attempted cutting of module with silicon removed showed that the module is not immobile during cutting

• movement in 10s of microns while cutting observed (could be solved with new/better knife and wheel)

Discussed

• status after last weeks cutting

• immediate steps needed for next cutting

• update on sensors for the transport box

ToDo:

1. repair knife and wheel (Gerrit)
2. measure friction due to vacuum (Marco, GS)
3. try to remove 2 silicon chips for future cutting simulations (GS)
4. measure module movement with deeper wheel bite and/or smaller cut angle (Paul, GS)
5. decide on the position of the sensors in the transport box (Paul, Marco)
6. install sensors (carpenter?)
7. measure environmental effects and shock on the transport box (Marco, GS)

Links

• [5] Mechanical department ALICE ITS documentation
• [6] ALICE ITS upgrade TDR
• [7] MOSAIC firmware and library
• [8] CERN ALPIDE testing software
• [9] Graphical interface for testing software
• [10] ITS upgrade indico categories
• [11] WP3 pixel chip design wiki
• [12] WP5 testing wiki
• [13] WP6-7-8 middle and outer layers wiki
• [14] WP10 read-out design wiki